Title:
PRESSURE SENSITIVE ADHESIVE FILM FOR WHEEL BONDING
Document Type and Number:
WIPO Patent Application WO/2008/111663
Kind Code:
A1
Abstract:
A pressure sensitive adhesive film for wheel bonding, comprising a substratum
film and, superimposed on one major surface thereof, a pressure sensitive adhesive
layer, which pressure sensitive adhesive film has a ring adhesive strength of
80 N or greater one hour after the bonding. [Here, the mentioned ring adhesive
strength one hour after the bonding refers to the exhibited maximum load as determined
in the following manner. The pressure sensitive adhesive film being circular
with a diameter of 100 mm is adhered by means of the pressure sensitive adhesive
layer on a ring-shaped coated aluminum frame of 100 mm outer diameter, 90 mm inner
diameter and 5 mm width in an atmosphere of 23°C 50% RH. Compression is applied
by means of a 2 kg roll, and a hole of 2 mm diameter is made in the center of the circular
pressure sensitive adhesive film. The shaft of a circular flat plate with shaft
having a shaft of 2 mm diameter perpendicularly erected on the center of a circular
flat plate of 80 mm diameter is let through the hole, and the circular pressure
sensitive adhesive film is adhered to the surface of the circular flat plate.
The assembly is allowed to stand still in an atmosphere of 23°C 50% RH for
one hour, and with the adhered circular pressure sensitive adhesive film placed
upside and with the ring-shaped coated aluminum frame horizontally fixed, the
circular flat plate with shaft having the circular pressure sensitive adhesive
film adhered thereto is lifted in the direction of the shaft at a shaft lifting
rate of 300 mm/min. The concerned maximum load is one exhibited in the lifting
of the shaft.] This pressure sensitive adhesive film for wheel bonding excels
in resistance to peeling at the application to automobile wheel.
Inventors:
TANAKA ATSUHIRO (JP)
TEZUNA ATSUSHI (JP)
TEZUNA ATSUSHI (JP)
Application Number:
PCT/JP2008/054694
Publication Date:
September 18, 2008
Filing Date:
March 07, 2008
Export Citation:
Assignee:
LINTEC CORP (JP)
TANAKA ATSUHIRO (JP)
TEZUNA ATSUSHI (JP)
TANAKA ATSUHIRO (JP)
TEZUNA ATSUSHI (JP)
International Classes:
F16D65/00; B60B7/00; C09J7/20; C09J201/00
Foreign References:
| JP2873910B2 | 1999-03-24 | |||
| JP2005281420A | 2005-10-13 | |||
| JP2003285806A | 2003-10-07 | |||
| JP2005155758A | 2005-06-16 |
Attorney, Agent or Firm:
ORIGUCHI, Shingo (14-7, Nishishinbashi 1-chome, Minato-k, Tokyo 03, JP)
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