Title:
PRESSURE-SENSITIVE ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2017/169895
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive film that renders a release paper unnecessary and enables broader applications. This pressure-sensitive adhesive film (10) is formed by stacking a transparent film base material (11), a first adhesive layer (12), and a second adhesive layer (13) in this order. A first film surface (10a) has a plurality of protrusions (17) formed therein, and the protrusions (17) are made of particulates (18). The first adhesive layer (12) and the second adhesive layer (13) contain a first adhesive compound and a second adhesive compound, respectively. The particulates (18) have a particle size distribution that shows two different peaks, both of which fall within a range of 2-15 μm.
Inventors:
NAKAMURA NAOKI (JP)
Application Number:
PCT/JP2017/010888
Publication Date:
October 05, 2017
Filing Date:
March 17, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B27/20; C09J7/20; C09J11/00
Foreign References:
| JP2005511853A | 2005-04-28 | |||
| JP2013513013A | 2013-04-18 | |||
| JP2014088506A | 2014-05-15 | |||
| JP2009197108A | 2009-09-03 |
Attorney, Agent or Firm:
KYORITSU INSTITUTE (JP)
Download PDF: