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Title:
PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE COMPOSITION, SOLVENT-FREE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2020/095870
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive layer which is excellent in bending durability and excellent in wet heat haze resistance while having excellent adhesive strength to an adherend, the pressure-sensitive adhesive layer being obtained by curing a pressure-sensitive adhesive composition [I] including an acrylic resin (X), wherein an adhesive force (α) is 25 N/25 mm or more, a bending durability (β) is 100,000 times or more, and a wet heat haze resistance (γ) is 1.0% or less, those properties being measured under predetermined conditions.

Inventors:
ASANO TETSUYA (JP)
NOHARA KAZUKI (JP)
Application Number:
PCT/JP2019/043197
Publication Date:
May 14, 2020
Filing Date:
November 05, 2019
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C09J133/00; C09J7/38
Domestic Patent References:
WO2014192827A12014-12-04
Foreign References:
JP2016188310A2016-11-04
JP2014108968A2014-06-12
JP2007177003A2007-07-12
JP2008248223A2008-10-16
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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