Title:
PRESSURE-SENSITIVE ADHESIVE LAYER FOR TRANSPARENT CONDUCTIVE FILM, TRANSPARENT CONDUCTIVE FILM WITH PRESSURE-SENSITIVE ADHESIVE LAYER, TRANSPARENT CONDUCTIVE LAMINATE, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2012/014814
Kind Code:
A1
Abstract:
This pressure-sensitive adhesive layer for transparent conductive film has a thickness of 10 to 100μm, and is formed from an aqueous-dispersion type acrylic pressure-sensitive adhesive which consists of an aqueous dispersion that comprises both a water-dispersible (meth)acrylic polymer and a water -soluble basic component, said water-dispersible (meth)acrylic polymer containing 1 to 8 parts by weight of copolymerized monomer units derived from a carboxyl-containing monomer relative to 100 parts by weight of the main monomer units derived from an alkyl (meth)acrylate wherein the alkyl moiety has 4 to 14 carbon atoms. Further, the pressure-sensitive adhesive layer contains 200 to 500000ng of the water-soluble basic component per square centimeter (cm2), as determined on the basis of the pressure -sensitive adhesive layer. The pressure-sensitive adhesive layer for transparent conductive film exhibits satisfactory durability even under high-temperature conditions and even under high-temperature and high-humidity conditions, and can inhibit corrosion even under high-temperature and high-humidity conditions.
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Inventors:
HOSOKAWA,Toshitsugu (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
細川 敏嗣 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
INUI,Kunihiro (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
乾 州弘 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
ISHII,Takaaki (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
石井 孝証 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
細川 敏嗣 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
INUI,Kunihiro (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
乾 州弘 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
ISHII,Takaaki (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
石井 孝証 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
Application Number:
JP2011/066731
Publication Date:
February 02, 2012
Filing Date:
July 22, 2011
Export Citation:
Assignee:
NITTO DENKO CORPORATION (1-1-2, ShimohozumiIbaraki-sh, Osaka 80, 〒5678680, JP)
日東電工株式会社 (〒80 大阪府茨木市下穂積１丁目１番２号 Osaka, 〒5678680, JP)
HOSOKAWA,Toshitsugu (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
細川 敏嗣 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
INUI,Kunihiro (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
乾 州弘 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
ISHII,Takaaki (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
日東電工株式会社 (〒80 大阪府茨木市下穂積１丁目１番２号 Osaka, 〒5678680, JP)
HOSOKAWA,Toshitsugu (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
細川 敏嗣 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
INUI,Kunihiro (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
乾 州弘 (〒80 大阪府茨木市下穂積１丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
ISHII,Takaaki (1-1-2 Shimohozumi,Ibaraki-sh, Osaka 80, 〒5678680, JP)
International Classes:
C09J133/00; B32B9/00; B32B27/30; C09J7/02; C09J11/06; G06F3/041; H01B5/14
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (SHIN-OSAKA MT Bldg. 1, 13-9 Nishinakajima 5-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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