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Title:
PRESSURE-SENSITIVE ADHESIVE SHEET FOR APPLICATION TO SKIN
Document Type and Number:
WIPO Patent Application WO/2005/032401
Kind Code:
A2
Abstract:
A pressure-sensitive adhesive sheet for application to the skin which has a pressure-sensitive adhesive layer which can be formed without using an organic solvent, has satisfactory adhesion to the skin, and is extremely reduced in skin irritation and damage to the horny layer. The pressure-sensitive adhesive sheet for application to the skin comprises a substrate and a pressure-sensitive adhesive layer superposed on the substrate, the pressure-sensitive adhesive layer being one obtained by curing a pressure-sensitive adhesive composition comprising a polyether polymer (A) having at least one terminal alkenyl group, a compound (B) having one to ten hydrosilyl groups per molecule, and a hydrosilylation catalyst (C).

Inventors:
HAMADA MASASHI (JP)
KINOSHITA TAKASHI (JP)
FURUMORI KENJI (JP)
UEDA KAZUHIKO (JP)
KOMITSU SHINTARO (JP)
Application Number:
PCT/JP2004/014683
Publication Date:
April 14, 2005
Filing Date:
September 29, 2004
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
KANEKA CORP (JP)
HAMADA MASASHI (JP)
KINOSHITA TAKASHI (JP)
FURUMORI KENJI (JP)
UEDA KAZUHIKO (JP)
KOMITSU SHINTARO (JP)
International Classes:
A61K9/70; A61K47/30; A61L15/00; A61L15/58; A61K47/32; A61K47/34; A61F; (IPC1-7): A61F/
Foreign References:
JPH07310066A1995-11-28
JP2002060456A2002-02-26
JPH04185687A1992-07-02
Other References:
"Market Prospect for Silicone - Manufacturer Strategy, Application and Development", 31 January 1990, CMC PUBLISHING CO., LTD.
See also references of EP 1679085A4
Attorney, Agent or Firm:
Takashima, Hajime (1-1 Fushimimachi 4-chome, Chuo-k, Osaka-shi Osaka, JP)
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