Title:
PRESSURE-SENSITIVE ADHESIVE SHEET AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/075767
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive sheet which comprises: a substrate having, on
at least one side, recesses and protrusions in which any adjoining two recesses
are interconnected to each other; and an air-impermeable pressure-sensitive
adhesive layer which is flat on each side and has been superposed on the rugged
side of the substrate so as to be in contact with the protrusions of the substrate.
Also provided is a process for pressure-sensitive-adhesive sheet production
in which a release sheet having a releasant-treated flat side and coated on this
side with an air-impermeable pressure-sensitive adhesive layer which is flat
on each side and a substrate having, on at least one side, recesses and protrusions
in which any adjoining two recesses are interconnected to each other are superposed
on each other so that the air-impermeable pressure-sensitive adhesive layer
is in contact with the protrusions of the substrate. By the process, a pressure-sensitive
adhesive sheet effective in preventing or eliminating air inclusion or blisters
can be produced without using a release sheet having surface recesses and protrusions.
Inventors:
TOMINO, Tadahiro (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
富能 忠寛 (〒01 東京都板橋区本町２３番２３号 リンテック株式会社内 Tokyo, 1730001, JP)
TABATA, Koji (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
田畠 浩司 (〒01 東京都板橋区本町２３番２３号 リンテック株式会社内 Tokyo, 1730001, JP)
富能 忠寛 (〒01 東京都板橋区本町２３番２３号 リンテック株式会社内 Tokyo, 1730001, JP)
TABATA, Koji (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
田畠 浩司 (〒01 東京都板橋区本町２３番２３号 リンテック株式会社内 Tokyo, 1730001, JP)
Application Number:
JP2007/074649
Publication Date:
June 26, 2008
Filing Date:
December 21, 2007
Export Citation:
Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 1730001, JP)
リンテック株式会社 (〒01 東京都板橋区本町２３番２３号 Tokyo, 1730001, JP)
TOMINO, Tadahiro (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
富能 忠寛 (〒01 東京都板橋区本町２３番２３号 リンテック株式会社内 Tokyo, 1730001, JP)
TABATA, Koji (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
リンテック株式会社 (〒01 東京都板橋区本町２３番２３号 Tokyo, 1730001, JP)
TOMINO, Tadahiro (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
富能 忠寛 (〒01 東京都板橋区本町２３番２３号 リンテック株式会社内 Tokyo, 1730001, JP)
TABATA, Koji (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
International Classes:
C09J7/02; C09J201/00
Attorney, Agent or Firm:
OHTANI, Tamotsu (OHTANI PATENT OFFICE, Bridgestone Toranomon Bldg.6F., 25-2, Toranomon 3-chom, Minato-ku Tokyo 01, 1050001, JP)
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