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Patent Searching and Data


Title:
PRESSURE-SENSITIVE ADHESIVE SHEET, PROCESS FOR PRODUCING SAME, AND PROCESS FOR PRODUCING OPTICAL MEMBER USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/117045
Kind Code:
A1
Abstract:
Disclosed are: a pressure-sensitive adhesive sheet which includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is a layer formed by curing a solvent-free curable resin composition by irradiation with actinic rays, the curable resin composition comprising a polyfunctional (meth)acrylate compound (C), a photopolymerization initiator, and a syrupy acrylic resin composition obtained by partially polymerizing, through bulk polymerization, a monomer composition comprising 50-85 mass% (meth)acrylic ester (A) having only one unsaturated double bond in the molecule and 15-50 mass% hydroxylated (meth)acrylic ester (B) having only one unsaturated double bond in the molecule, some of the (meth)acrylate compounds (A) and (B) remaining unreacted in the pressure-sensitive adhesive layer; a process for producing the pressure-sensitive adhesive sheet; and a process for producing an optical member using the pressure-sensitive adhesive sheet.

Inventors:
KAWAGUCHI TAKEO (JP)
TSUCHIYA YASUSHI (JP)
TANAKA TAKESHI (JP)
Application Number:
PCT/JP2015/051468
Publication Date:
July 28, 2016
Filing Date:
January 21, 2015
Export Citation:
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Assignee:
TERAOKA SEISAKUSHO KK (JP)
International Classes:
C09J4/02; C09J5/00; C09J7/10; C09J11/06; C09J133/06; C09J133/14
Foreign References:
JP2013166846A2013-08-29
JP2014094976A2014-05-22
JP2013256552A2013-12-26
JP2013061938A2013-04-04
Attorney, Agent or Firm:
ISHIBASHI, Masayuki et al. (JP)
Masayuki Ishibashi (JP)
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