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Title:
PRESSURE-SENSITIVE ADHESIVE SHEET FOR TIRE
Document Type and Number:
WIPO Patent Application WO/2006/070529
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive sheet for a tire which has a base material and a pressure-sensitive adhesive layer, wherein said pressure-sensitive adhesive layer comprises a hot-melt type adhesive composition and further satisfies the following pressure-sensitive adhesion characteristics (A) and (B): (A) it exhibits a value of 7 N/25 mm or more in terms of the pressure-sensitive adhesion strength to a SBR plate at 5&ring C, and (B) it exhibits a value of 7 N/25 mm or more in terms of the pressure-sensitive adhesion strength to a SBR plate at 40&ring C. The above pressure-sensitive adhesive sheet exhibits a high pressure-sensitive adhesion strength to a tire in a wide range of temperature region and has a good pressure-sensitive adhesion strength also to a studless tire.

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Inventors:
TABATA KOUJI (JP)
Application Number:
PCT/JP2005/019529
Publication Date:
July 06, 2006
Filing Date:
October 25, 2005
Export Citation:
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Assignee:
LINTEC CORP (JP)
TABATA KOUJI (JP)
International Classes:
B60C19/00; C09J7/29; G09F3/10
Foreign References:
JP2004518770A2004-06-24
JPH07268311A1995-10-17
JPH1180690A1999-03-26
Other References:
KOBUNSHI KANKOKAI: "Hotmelt Secchaku no Jissai.", 20 March 1987 (1987-03-20), pages 67 - 73, XP003016072
See also references of EP 1780252A4
Attorney, Agent or Firm:
Emori, Kenji (11-3 Shinjuku 1-chome, Shinjuku-k, Tokyo 22, JP)
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