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Title:
PRESSURE-SENSITIVE ADHESIVE TAPE, HARNESS-BUNDLING SHEET, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/002634
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a pressure-sensitive adhesive tape which, even when used to affix an adherend containing a plasticizer, does not experience peeling at the interface between the adherend and a pressure-sensitive adhesive layer, and can maintain the affixation over a long length of time. The present invention pertains to a pressure-sensitive adhesive tape used to affix an adherend (a1) containing a plasticizer, the pressure-sensitive adhesive tape being characterized by: having a pressure-sensitive adhesive layer (b1) on one surface side of an air-permeable substrate and having a pressure-sensitive adhesive layer (b2) on the other surface side; the total basis weight of the pressure-sensitive adhesive layer (b1) and the pressure-sensitive adhesive layer (b2) being in the range of 125 to 175 g/m2; and the total gel fraction of the pressure-sensitive adhesive layer (b1) and the pressure-sensitive adhesive layer (b2) being 2 to 35 mass%.

Inventors:
SHIMOOKA Sumio (Saitama Plant 4472-1, Oaza Komuro, Ina-machi, Kitaadachi-gu, Saitama 77, 〒3628577, JP)
MORINO Akinori (Saitama Plant 4472-1, Oaza Komuro, Ina-machi, Kitaadachi-gu, Saitama 77, 〒3628577, JP)
Application Number:
JP2016/067921
Publication Date:
January 05, 2017
Filing Date:
June 16, 2016
Export Citation:
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Assignee:
DIC CORPORATION (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
International Classes:
C09J7/02; B32B27/00; B65D63/10; H01B7/00
Attorney, Agent or Firm:
KONO Michihiro (7-20 Nihonbashi 3-chome, Chuo-k, Tokyo 33, 〒1038233, JP)
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