Title:
PRESSURE-SENSITIVE ADHESIVE TAPE, HEAT RADIATION SHEET AND ELECTRONIC INSTRUMENT
Document Type and Number:
WIPO Patent Application WO/2017/145773
Kind Code:
A1
Abstract:
[Problem] To provide a thin pressure-sensitive adhesive tape which allows air bubbles to quickly escape from the interface with an adherend so as to suppress remaining of air bubbles at the interface, has a high adhesiveness and causes no worsening in appearance even in the case where the adherend has a thin thickness.
[Solution] A pressure-sensitive adhesive tape which is provided with two or more pressure-sensitive adhesive parts in at least one surface side of a support and has a total thickness of 20 μm or less, characterized in that: the thickness of the pressure-sensitive adhesive parts is within the range of 1-15 μm; the area of each pressure-sensitive adhesive part is 0.02-0.5 mm2; and the distance between an arbitrary pressure-sensitive adhesive part and the nearest pressure-sensitive adhesive part is within the range of 0.03-0.2 mm.
Inventors:
IMAI KATSUAKI (JP)
YAMAKAMI AKIRA (JP)
YAMAKAMI AKIRA (JP)
Application Number:
PCT/JP2017/004698
Publication Date:
August 31, 2017
Filing Date:
February 09, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B7/14; B32B9/00; B32B27/00; C09J7/20; C09J201/00; H05K7/20
Domestic Patent References:
| WO2016163537A1 | 2016-10-13 | |||
| WO2016111208A1 | 2016-07-14 | |||
| WO2017022749A1 | 2017-02-09 |
Foreign References:
| JP2010174148A | 2010-08-12 | |||
| JPH09506564A | 1997-06-30 | |||
| JP3018714U | 1995-11-28 | |||
| JP2011042773A | 2011-03-03 | |||
| JP2007154144A | 2007-06-21 | |||
| JP2001110965A | 2001-04-20 | |||
| JP2005272763A | 2005-10-06 | |||
| JP2002319653A | 2002-10-31 | |||
| JP2010254979A | 2010-11-11 | |||
| JP2011216671A | 2011-10-27 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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