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Patent Searching and Data


Title:
PRESSURE SENSITIVE ADHESIVE TAPE AND METHOD OF LENS SHAPE MACHINING
Document Type and Number:
WIPO Patent Application WO/2004/067227
Kind Code:
A1
Abstract:
A pressure sensitive adhesive tape to be disposed between a lens and at least one of a pair of chucks fitted to a lapping machine, which pressure sensitive adhesive tape has an adhesive surface to be brought into contact with the lens that exhibits an adhesive strength of 4 gf (0.0392 N) or greater as measured in accordance with the method of adhesive strength testing through 180° peeling specified in JIS Z 0237 “method of testing pressure sensitive adhesive tape or pressure sensitive adhesive sheet”, in which a polyethylene terephthalate plate having been surface treated with a fluorinated silicone release agent is used as the test plate. Thus, there is provided a technique of shape machining of a lens provided with an antifouling layer of fluorinated silane compound excelling in antifouling effects.

Inventors:
KAWASE AKIKO (JP)
KATAGIRI HIROSHI (JP)
SUZUKI KEIICHI (JP)
TAKESHITA KATSUYOSHI (JP)
Application Number:
PCT/JP2003/015192
Publication Date:
August 12, 2004
Filing Date:
November 27, 2003
Export Citation:
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Assignee:
SEIKO EPSON CORP (JP)
KAWASE AKIKO (JP)
KATAGIRI HIROSHI (JP)
SUZUKI KEIICHI (JP)
TAKESHITA KATSUYOSHI (JP)
International Classes:
B24B9/14; B24B13/005; C09J7/10; C09J201/00; (IPC1-7): B24B9/14
Foreign References:
JP2002263998A2002-09-17
JP2000024936A2000-01-25
JPH08229794A1996-09-10
JPH0624852U1994-04-05
JPH09258003A1997-10-03
Other References:
See also references of EP 1588800A4
Attorney, Agent or Firm:
Kamiyanagi, Masataka c/o Intellectual, Property Division (SEIKO EPSON CORPORATION 3-5, Owa 3-Chom, Suwa-Shi Nagano, JP)
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