PRESSURE-SENSITIVE ADHESIVE TAPE FOR PASTING WAFER THERETO

Title:

PRESSURE-SENSITIVE ADHESIVE TAPE FOR PASTING WAFER THERETO

Document Type and Number:

WIPO Patent Application WO/2004/069951

Kind Code:

A1

Abstract:

A pressure-sensitive adhesive tape for pasting a wafer thereto having a base material and, formed on the surface thereof, a radiation-curable pressure-sensitive adhesive layer, and optionally an adhesive layer for adhering a die, wherein the radiation-curable pressure-sensitive adhesive layer comprises, as a main component, an acrylic copolymer comprising, on its main chain, a group having a radiation-curable carbon-carbon double bonding, a group having a hydroxyl group and a group having a carboxyl group, and has a gel content of 60 % or more.

Inventors:

MORISHIMA YASUMASA (JP)
KITA KENJI (JP)
ISHIWATA SHINICHI (JP)

Application Number:

PCT/JP2004/001038

Publication Date:

August 19, 2004

Filing Date:

February 03, 2004

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FURUKAWA ELECTRIC CO LTD (JP)
MORISHIMA YASUMASA (JP)
KITA KENJI (JP)
ISHIWATA SHINICHI (JP)

International Classes:

C09J7/02; H01L21/68; H01L21/00; (IPC1-7): C09J7/02; H01L21/02

Foreign References:

JPH0745557A	1995-02-14
JP2002158276A	2002-05-31
JPH07235583A	1995-09-05
JPH09298173A	1997-11-18

Other References: