Title:
PRESSURE-SENSITIVE ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFERS
Document Type and Number:
WIPO Patent Application WO/2014/136777
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive tape for processing semiconductor wafers. Said pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer on a base sheet, and if said base sheet is compressed at 1 mm/min in the thickness direction thereof by an indenter having a tip shape with R = 5.0 ± 0.1 mm (i.e. 4.9 mm ≤ R ≤ 5.1 mm), the change over time (A) in the restoring force produced by the base sheet over the first five seconds of stress relaxation from a state in which the displacement that produces a restoring force of 50 N is maintained is between 0.23 and 0.28 N/s, inclusive, and the ratio (B/A) between the change over time (B) in said restoring force over the subsequent five seconds and the aforementioned change over time (A) is between 0.40 and 0.45, inclusive.
Inventors:
OTA SATOSHI (JP)
YABUKI AKIRA (JP)
YABUKI AKIRA (JP)
Application Number:
PCT/JP2014/055472
Publication Date:
September 12, 2014
Filing Date:
March 04, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J7/02; C09J11/06; C09J201/00
Domestic Patent References:
| WO2012014487A1 | 2012-02-02 |
Foreign References:
| JP2008166728A | 2008-07-17 | |||
| EP0999250A2 | 2000-05-10 | |||
| JP2011216704A | 2011-10-27 | |||
| JP2011151355A | 2011-08-04 | |||
| JP2009130333A | 2009-06-11 | |||
| JPH05175332A | 1993-07-13 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
Download PDF:
Previous Patent: RESIN PARTICLES FOR FLUORESCENT LABELS
Next Patent: METHOD FOR PRODUCING ETHYLENE/α-OLEFIN COPOLYMER
Next Patent: METHOD FOR PRODUCING ETHYLENE/α-OLEFIN COPOLYMER