Title:
PRESSURE-SENSITIVE ADHESIVE TAPE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/116845
Kind Code:
A1
Abstract:
The problem to be solved with the present invention is to provide a pressure-sensitive adhesive tape which enables air bubbles to rapidly escape from the boundary between the adhesive tape and an adherend, thereby preventing the air bubbles from remaining at the boundary and which is excellent in terms of adhesiveness and cushioning property and is inexpensive and thin.
The present invention relates to a pressure-sensitive adhesive tape which comprises a foam layer (A), a resin film layer (C), and two or more pressure-sensitive adhesive parts (B) disposed on the resin film (C) side surface, characterized in that regions having no pressure-sensitive adhesive part (B) lie between the two or more adhesive parts (B) and the regions extend to the edges of the pressure-sensitive adhesive tape.
Inventors:
YAMAKAMI AKIRA (JP)
IMAI KATSUAKI (JP)
IMAI KATSUAKI (JP)
Application Number:
PCT/JP2017/043962
Publication Date:
June 28, 2018
Filing Date:
December 07, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J7/20; B32B5/18; B32B27/00; B32B27/40; C09J201/00; G09F9/00
Foreign References:
| JP2015214134A | 2015-12-03 | |||
| JP2010070740A | 2010-04-02 | |||
| JPH0880688A | 1996-03-26 | |||
| JPH0581248U | 1993-11-05 | |||
| JPH11291434A | 1999-10-26 | |||
| JP2016108532A | 2016-06-20 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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