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Title:
PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2013/141167
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive tape which comprises a foam base and a pressure-sensitive adhesive layer formed on at least one surface of the base, wherein the foam base has a thickness of 120 µm or less, a strength at 25% compression of 160 MPa or higher, and a density of 0.4 g/cm3 or higher, and the average thickness-direction cell diameter of the foam base is 23-50 µm. Although thin, this pressure-sensitive adhesive tape not only can have excellent waterproofing properties due to the satisfactory conformability to the adherend and have such resistance to drop impacts that peeling of the pressure-sensitive adhesive tape or cracking of the foam base is less apt to occur upon dropping, but also makes it possible to attain such excellent reworkability that in case of a trouble, the component can be efficiently separated.

Inventors:
KOMATSUZAKI YUKI (JP)
IWASAKI TAKESHI (JP)
TAKEI HIDEAKI (JP)
Application Number:
PCT/JP2013/057487
Publication Date:
September 26, 2013
Filing Date:
March 15, 2013
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J7/26; B32B5/18; B32B27/00; B32B27/30; B32B27/32; C09J133/00
Domestic Patent References:
WO2009044690A12009-04-09
WO2005007731A12005-01-27
Foreign References:
JP2010260880A2010-11-18
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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