Title:
PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/013532
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that has high adhesive strength to rough surfaces and excellent shear strength at high temperatures. Further, a pressure-sensitive adhesive tape according to the present invention has a base material and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a (meth)acrylic copolymer and a cross-linking agent; when a sol component of the pressure-sensitive adhesive layer is measured by GPC based on differential refractometer RI detection, in the region of molecular weights of 5,000 or more, the proportion of molecular weights of 100,000 or less is 5-75% and the proportion of molecular weights of 600,000 or more is 0.5-16%; and the content of the (meth)acrylic monomer in the pressure-sensitive adhesive layer is 2.5% by weight or less.
Inventors:
KAWAMOTO TOMOYA (JP)
OGATA YUDAI (JP)
TODA TOMOKI (JP)
OGATA YUDAI (JP)
TODA TOMOKI (JP)
Application Number:
PCT/JP2022/029239
Publication Date:
February 09, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J7/38; B24B37/12; C09J133/06; C09J175/04; H01L21/304
Domestic Patent References:
| WO2021125247A1 | 2021-06-24 |
Foreign References:
| JP2009173746A | 2009-08-06 | |||
| JP2001234135A | 2001-08-28 | |||
| JP2003034781A | 2003-02-07 | |||
| JP2003049143A | 2003-02-21 | |||
| JP2020158756A | 2020-10-01 | |||
| JP2020122141A | 2020-08-13 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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