PRESSURE-SENSITIVE ADHESIVE

Title:

PRESSURE-SENSITIVE ADHESIVE

Document Type and Number:

WIPO Patent Application WO/2016/171269

Kind Code:

A1

Abstract:

Provided is a method for producing a pressure-sensitive adhesive, in which a cured product of a curable composition that contains an organic polymer having a crosslinkable silicon group and an adhesion-imparting resin is provided as a pressure-sensitive adhesive layer, wherein the curing of the curable composition cannot proceed even by heating the curable composition in the production of the pressure-sensitive adhesive, in other words, the curable composition can exhibit excellent stability during the heating and the crosslinking reaction of the curable composition can proceed by some sort of trigger. In the pressure-sensitive adhesive, a cured product of a curable composition comprising (A) an organic polymer having a crosslinkable silicon group, (B) an adhesiveness-imparting resin, (C) a silicon compound having an Si-F bond and (D) a photo base generator is provided as a pressure-sensitive adhesive layer.

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Inventors:

KOUNO SHOUMA (JP)
MIDORIKAWA TOMOHIRO (JP)
OKAMURA NAOMI (JP)
YAMAGA HIROSHI (JP)

Application Number:

PCT/JP2016/062820

Publication Date:

October 27, 2016

Filing Date:

April 22, 2016

Export Citation:

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Assignee:

CEMEDINE CO LTD (JP)

International Classes:

C09J7/35; C09J201/10; C09J7/00; C09J7/38; C09J11/06; C09J11/08; C09J133/04; C09J171/02

Domestic Patent References:

WO2015008709A1

2015-01-22

Foreign References:

JP2004115780A	2004-04-15
JP2004115779A	2004-04-15
JP2013241578A	2013-12-05
JP2004512417A	2004-04-22

Other References: