Title:
PRESSURE-SENSITIVE TAPE AND SEMICONDUCTOR WAFER-PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/165551
Kind Code:
A1
Abstract:
The invention addresses the problem of providing a pressure-sensitive tape for protecting the outer edge of semiconductor wafers during semiconductor wafer manufacturing processes and preventing unexpected processing of the outer edge portion. Provided is a pressure-sensitive tape (1), which is obtained from a substrate and a pressure-sensitive adhesive layer laminated on one side of the substrate and which is wrapped on the outer edge (51) of a semiconductor wafer (5) and attached to the peripheral region that is a specified width (w) from the edge. The tensile force necessary for a 5% elongation is 5 - 10 N/10 mm.
Inventors:
INADA TARO (JP)
Application Number:
PCT/JP2012/064083
Publication Date:
December 06, 2012
Filing Date:
May 31, 2012
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
INADA TARO (JP)
INADA TARO (JP)
International Classes:
C09J7/02; H01L21/3065
Foreign References:
| JPH041286A | 1992-01-06 | |||
| JPH0812949A | 1996-01-16 | |||
| JP2003027665A | 2003-01-29 | |||
| JP2010251632A | 2010-11-04 | |||
| JP2007324186A | 2007-12-13 |
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
Yoshitaka Sonoda (JP)
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Claims: