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Patent Searching and Data


Title:
PRESSURE SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/125451
Kind Code:
A1
Abstract:
Provided is a pressure sensor device comprising a sensor chip (2) that is a plate-shaped chip and is provided with a concavity (21b) in a first surface thereof, whereby a bottom portion (21c) of the concavity serves as a diaphragm (21a) which is a thin portion having a pressure detection function. Pressure is detected by the diaphragm being exposed to a pressure medium at the side of the concavity. The bottom portion of the concavity corresponding to the diaphragm, and a side wall portion (21d) of the concavity located in the periphery of the bottom portion, are covered by a protective member (8) that has a higher liquid repellent property or a higher lyophilic property than the surface of the concavity. Unevenness treatment is performed only on the surface of the side wall portion, out of the bottom portion and the side wall portion, and the protective member is provided at a surface (21e) of the side wall portion having been subjected to the unevenness treatment.

Inventors:
KAWANO SHINJI (JP)
MAWATARI KAZUAKI (JP)
Application Number:
PCT/JP2016/000369
Publication Date:
August 11, 2016
Filing Date:
January 26, 2016
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
G01L9/00; H01L29/84
Domestic Patent References:
WO2009041463A12009-04-02
Foreign References:
JPH10185721A1998-07-14
JP2010071680A2010-04-02
JPH07326770A1995-12-12
JP2009505088A2009-02-05
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
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