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Patent Searching and Data


Title:
PRESSURE SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/233772
Kind Code:
A1
Abstract:
Provided is a pressure sensor device with which the possibility that discharged electricity will reach a detection element can be lowered. A pressure sensor device according to the present invention comprises: a base substrate (20); a detection element (30) that is mounted on the upper surface of the base substrate (20), and that detects pressure; and a resin package (50) that is provided on the upper surface of the base substrate (20), and in which the detection element (30) is buried, and that has an exposure hole (52C) that exposes a detection region (102), which is a portion of the detection element (30), to the outside. A ground electrode (32) that is electrically connected to ground is formed on at least a portion of a boundary region (103) of the detection region, said boundary region being a boundary with respect to an inside surface (52A) of the exposure hole (52C).

Inventors:
SAITOU GOU (JP)
OCHIAI CHITAKA (JP)
Application Number:
PCT/JP2023/011602
Publication Date:
December 07, 2023
Filing Date:
March 23, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L9/00; G01L19/14; H01L29/84
Domestic Patent References:
WO2022102234A12022-05-19
WO2013129444A12013-09-06
Foreign References:
JP2022050096A2022-03-30
JP2001196505A2001-07-19
JP3228886U2020-11-19
US20130093031A12013-04-18
JP2005181066A2005-07-07
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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