Title:
PRESSURE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/137027
Kind Code:
A1
Abstract:
Disclosed is a pressure sensor package. A pressure sensor package of the present invention comprises: a base substrate; an ASIC and a MEMS pressure sensor located on one surface of the base substrate; a housing which is coupled to the base substrate, forms an inner space for receiving the ASIC and the MEMS pressure sensor, and includes at least one air hole; and a sealing material for surrounding the ASIC and the MEMS pressure sensor in the inner space.
Inventors:
KIM TAE WON (KR)
YOO DONG HYUN (KR)
CHO KWANG RAE (KR)
KIM KYU SEOB (KR)
YOO DONG HYUN (KR)
CHO KWANG RAE (KR)
KIM KYU SEOB (KR)
Application Number:
PCT/KR2015/001804
Publication Date:
September 01, 2016
Filing Date:
February 25, 2015
Export Citation:
Assignee:
PARTRON CO LTD (KR)
International Classes:
G01L9/00; G01L7/02; G01L19/06; G01L19/14
Foreign References:
| US20120291559A1 | 2012-11-22 | |||
| US20100300207A1 | 2010-12-02 | |||
| JPH05291590A | 1993-11-05 | |||
| JPH07218364A | 1995-08-18 | |||
| JPH09126920A | 1997-05-16 |
Attorney, Agent or Firm:
CHOI, HAK HYUN (KR)
최학현 (KR)
최학현 (KR)
Download PDF: