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Patent Searching and Data


Title:
PRESSURE SENSOR AND PRODUCTION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2007/004400
Kind Code:
A1
Abstract:
To improve work efficiency and realize a low-cost structure without electrically damaging the electronic components of a pressure sensor. Contact pins (27-1 to 3) connected via a binding wire material to a pressure detecting sensor chip are mounted to a resin body (12). The ends of electric wires (50-1 to 3) connected with an external apparatus are semi-stripped and simultaneously ultrasonic-welded to three contact pins (27-1 to 3) using an ultrasonic-welding machine. Partition plates (34) are provided between the contact pins to prevent short-circuiting between electric wires. Each contact pin (27-1 to 3) is provided with a hole (38) for reducing its rigidity to prevent the connection of spot-welded contact pins and a binding wire material from being disconnected at ultrasonic-welding. After the electric wires (50-1 to 3) and the contact pins (27-1 to 3) are ultrasonic-welded, a resin case (40) is placed over the resin body (12) to allow a sealant (42) to poured in.

Inventors:
SUZUKI, Kazushige (INC. Tokorozawa-jigyousho 1311 Aobada, Tokorozawa-shi Saitama 05, 3591105, JP)
鈴木和重 (〒05 埼玉県所沢市青葉台1311 株式会社鷺宮製作所 所沢事業所内 Saitama, 3591105, JP)
Application Number:
JP2006/312006
Publication Date:
January 11, 2007
Filing Date:
June 15, 2006
Export Citation:
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Assignee:
SAGINOMIYA SEISAKUSHO, INC. (55-5, Wakamiya 2-chome Nakano-ku Tokyo, 33, 1650033, JP)
株式会社 鷺宮製作所 (〒33 東京都中野区若宮2丁目55番5号 Tokyo, 1650033, JP)
SUZUKI, Kazushige (INC. Tokorozawa-jigyousho 1311 Aobada, Tokorozawa-shi Saitama 05, 3591105, JP)
International Classes:
G01L19/14
Attorney, Agent or Firm:
TAKAHASHI, Hideo et al. (Yukon Tokkyo Jimusho, Shinkawa-Ohara BLDG. 6F 27-8 Shinkawa 1-chom, Chuo-ku Tokyo 33, 1040033, JP)
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