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Title:
PRESSURE SENSOR AND VACUUM PROCESSING APPARATUS USING PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2014/057536
Kind Code:
A1
Abstract:
The present invention addresses the issue of providing a small pressure sensor, which has a simple and robust structure, and high measurement accuracy, and a vacuum processing apparatus that is provided with the pressure sensor. A pressure sensor (1) of the present invention is provided with: a sensor unit (2), which is provided with a base section (4) having a hollow portion (4a) formed therein, a polymer film (5) that is provided on the front surface of the base section (4), a first thin film sensor (6) that is provided on the front surface region (5b) of the polymer film (5), and a second thin film sensor (7) that is provided on the front surface region (5c) of the polymer film (5); and a control unit (3) that is provided with a first drive section, which supplies power to the first thin film sensor (6) such that the temperature of the first thin film sensor (6) is maintained at a predetermined temperature, and a second drive section, which supplies to the second thin film sensor (7) a minute current that does not affect the temperature of the second thin film sensor (7). The first thin film sensor (6) and the second thin film sensor (7) are configured such that the resistance values thereof change corresponding to temperature.

Inventors:
OGAWA SOICHI (JP)
MIMA HIROSHI (JP)
OKANO YUKIKO (JP)
TAJIRI SHUICHI (JP)
AOZONO TAKASHI (JP)
Application Number:
PCT/JP2012/076175
Publication Date:
April 17, 2014
Filing Date:
October 10, 2012
Export Citation:
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Assignee:
OKANO WORKS LTD (JP)
OGAWA SOICHI (JP)
MIMA HIROSHI (JP)
International Classes:
G01L21/12
Foreign References:
US5557972A1996-09-24
JP2011137679A2011-07-14
JP2005172451A2005-06-30
JP2007526143A2007-09-13
JP2005077343A2005-03-24
JP2000024483A2000-01-25
JP2009300381A2009-12-24
Attorney, Agent or Firm:
MINORI Patent Profession Corporation (JP)
Patent business corporation Minori patent firm (JP)
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