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Patent Searching and Data


Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2017/002306
Kind Code:
A1
Abstract:
This pressure sensor has a sensor chip (10) and a resin section (40). The sensor chip is provided with: a membrane (11c), which extends in the longer-side direction, and the length of which in the thickness direction is shorter than the lengths of other portions, said thickness direction being orthogonal to the longer-side direction; and a piezoelectric element (20) that is provided to the membrane. The resin section supports the sensor chip in a cantilever manner. The sensor chip has: a supporting end (10a), which is covered with and fixed to the resin section; and a free end (10b), which is an end portion on the opposite side to the supporting end in the longer-side direction. The free end is separated from the resin section in the longer-side direction, and the membrane is disposed on the free end that is separated from the resin section. The shortest distance in the longer-side direction between the membrane and a resin section portion covering the sensor chip is equal to or longer than a sensor chip length in the shorter-side direction orthogonal to the longer-side direction and the thickness direction. With this pressure sensor, a size increase of the sensor chip can be suppressed, while suppressing occurrence of warpage of the membrane.

Inventors:
OONO KAZUYUKI (JP)
HASHIMOTO KOUJI (JP)
Application Number:
PCT/JP2016/002679
Publication Date:
January 05, 2017
Filing Date:
June 02, 2016
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
G01L9/00; H01L29/84
Foreign References:
JP2014102225A2014-06-05
JP5454628B22014-03-26
Attorney, Agent or Firm:
KIN, Junhi (JP)
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