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Patent Searching and Data


Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/074094
Kind Code:
A1
Abstract:
This pressure sensor (1) is provided with a sensor chip (2) and a support member (3). The support member supports the sensor chip at a position spaced away from a diaphragm (23). The pressure sensor is configured such that when h is the distance between a bonding surface (20a) bonded to the support member and a gauge surface (20b) on the opposite side of the bonding surface (20a), d1 is the diameter of an inscribed circle of the sensor chip, t is the plate thickness of the diaphragm, and d2 is the diameter of an inscribed circle of the diaphragm, h = 0.3-2.5 mm, d1 = 0.7-2.5 mm, h/d1 ≥ 1, t = 5-15 μm, and d2 = 350-700 μm.

Inventors:
INABA AKIRA (JP)
MURATA MINORU (JP)
Application Number:
PCT/JP2017/032337
Publication Date:
April 26, 2018
Filing Date:
September 07, 2017
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
G01L9/00; H01L29/84
Foreign References:
JP2012233847A2012-11-29
US7111518B12006-09-26
JPH1073505A1998-03-17
JP2007057284A2007-03-08
JP2013011478A2013-01-17
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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