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Patent Searching and Data


Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/039926
Kind Code:
A1
Abstract:
The present invention comprises: a sensor element (21) that detects a pressure; a sensor package (3) that stores the sensor element (21); and a support structure (32) that supports the sensor element (21) inside the sensor package (3). The support structure 32 has: a ring-shaped support diaphragm (14) of which the outer edge is fixed to the package; and a pedestal member (41) that is formed of a material having a thermal expansion coefficient within a predetermined range and sandwiches the support diaphragm (14) between the pedestal member and the sensor element (21). The sensor element (21) is joined to the support diaphragm (14) in a state in which an opening portion (14a) of the support diaphragm (14) is closed. The pedestal member (41) has a pressure guiding portion (42), and is joined to the support diaphragm (14) such that the pressure guiding portion overlaps the opening portion (14a) of the support diaphragm (14). According to the present invention, it is possible to reduce size and manufacturing costs.

Inventors:
SEKINE MASASHI (JP)
ISHIHARA TAKUYA (JP)
SOEDA MASARU (JP)
Application Number:
PCT/JP2019/031056
Publication Date:
February 27, 2020
Filing Date:
August 07, 2019
Export Citation:
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Assignee:
AZBIL CORP (JP)
International Classes:
G01L19/00
Foreign References:
US20180209863A12018-07-26
JP2009505041A2009-02-05
JP2008070241A2008-03-27
JP2006003234A2006-01-05
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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