Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/137742
Kind Code:
A1
Abstract:
In this invention, a band-like shield member 20 comprises: a blocking part 20A that is positioned directly above a signal processing electronic circuit part of a sensor chip 16 disposed in a recessed chip placement part of a sensor chip/terminal fixing member 14; a fixed end part 20B that is connected to one end of the blocking part 20A and is fixed to the sensor chip/terminal fixing member 14; and a fixed end part 20C that is connected to the other end of the blocking part 20A and is fixed to the sensor chip/terminal fixing member 14. The blocking part 20A is disposed at a position that is between the first ends of a plurality of bonding wires Wi that are connected to the sensor chip 16 and face each other so as to correspond in the width direction of the blocking part 20A and is closer to the surface of the sensor chip 16 than the positions of bent parts of the bonding wires Wi.
Inventors:
TAKIMOTO KAZUYA (JP)
NAKAMURA TAKESHI (JP)
NAKAMURA TAKESHI (JP)
Application Number:
PCT/JP2021/037797
Publication Date:
June 30, 2022
Filing Date:
October 12, 2021
Export Citation:
Assignee:
SAGINOMIYA SEISAKUSHO INC (JP)
International Classes:
G01L19/00
Foreign References:
| JP2019100808A | 2019-06-24 | |||
| JP2018179649A | 2018-11-15 | |||
| JP2015031573A | 2015-02-16 | |||
| JP2006078417A | 2006-03-23 | |||
| US5319981A | 1994-06-14 | |||
| JP2019100807A | 2019-06-24 | |||
| JP2019100808A | 2019-06-24 | |||
| JP2017194401A | 2017-10-26 |
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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