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Patent Searching and Data


Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/249769
Kind Code:
A1
Abstract:
A pressure sensor according to the present invention is provided with a board, a first detecting element and a second detecting element which are mounted on an upper surface of the board and each of which includes a detecting unit for detecting pressure, and a resin package covering the first detecting element and the second detecting element. The resin package has a first exposing hole which exposes the detecting unit of the first detecting element upwards, and a second exposing hole exposing the detecting unit of the second detecting element upward. The resin package and the board have a rotationally symmetrical outer shape as seen from an orthogonal direction orthogonal to the upper surface of the board. When seen from the orthogonal direction, the first detecting element and the second detecting element are positioned with point symmetry with respect to a center point of the rotational symmetry of the resin package and the board.

Inventors:
YOSHIDA YOSHIHIRO (JP)
NAKANISHI TAKESHI (JP)
ASADA TAKAHIRO (JP)
Application Number:
PCT/JP2022/017106
Publication Date:
December 01, 2022
Filing Date:
April 05, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L9/00; G01L15/00
Foreign References:
US20140107527A12014-04-17
JPH09133599A1997-05-20
US20200319050A12020-10-08
JP2012154801A2012-08-16
JP2012002688A2012-01-05
JP2014006138A2014-01-16
US20020134163A12002-09-26
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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