Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2024/004248
Kind Code:
A1
Abstract:
This pressure sensor comprises: a pressure detection unit having a pressure chamber, a semiconductor sensor chip that detects the pressure of a fluid introduced into the pressure chamber, and a lead pin that is connected to the semiconductor sensor chip and constitutes an external input/output terminal of the semiconductor sensor chip; and a signal sending unit that is adjacent to the pressure detection unit and has a connector housing that defines a board accommodation section, a connector connection section, and a partition between the board accommodation section and the connector connection section, a connection terminal for making a signal connection with the outside, a conversion board that is accommodated in the board accommodation section and adjusts signals communicated with the pressure detection unit through the lead pin and adjusts signals communicated with the outside through the connection terminal, and a heat generating component that is mounted on the conversion board and fixed to the connector housing by a heat-dissipating adhesive. The heat-dissipating adhesive is distributed over an adhesive reservoir area that extends in a direction perpendicular to the direction in which the signal sending unit is adjacent to the pressure detection unit.
Inventors:
TAKIMOTO KAZUYA (JP)
ITAGAKI TOMONORI (JP)
SETOGAWA HIROTAKA (JP)
ITAGAKI TOMONORI (JP)
SETOGAWA HIROTAKA (JP)
Application Number:
PCT/JP2023/003469
Publication Date:
January 04, 2024
Filing Date:
February 02, 2023
Export Citation:
Assignee:
SAGINOMIYA SEISAKUSHO INC (JP)
International Classes:
G01L19/14; G01L19/04
Domestic Patent References:
| WO2022097437A1 | 2022-05-12 |
Foreign References:
| JP2010243428A | 2010-10-28 | |||
| JP2014235072A | 2014-12-15 | |||
| US20120104518A1 | 2012-05-03 |
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
Download PDF: