Title:
PRESSURE UNIT
Document Type and Number:
WIPO Patent Application WO/2012/124783
Kind Code:
A1
Abstract:
Provided is a pressure unit with which it is possible to absorb deviations in dimensions when manufacturing an object to be pressured, and to achieve greater thinness with a simple configuration. The pressure unit pressures a semiconductor layer unit wherein semiconductor element modules and coolant pipes which make contact with the semiconductor element modules and cool the semiconductor element modules are alternately stacked. The pressure unit comprises: a spring member wherein a wire material is wound into a coil shape, a pitch angle whereof changing periodically; and a housing member, whereto the end parts of the spring member are attached.
Inventors:
TAKAMURA NORITOSHI (JP)
MASUDA MICHIYA (JP)
SASUGA ICHIRO (JP)
KATO NOBUHARU (JP)
TSURUGAI KENGO (JP)
MASUDA MICHIYA (JP)
SASUGA ICHIRO (JP)
KATO NOBUHARU (JP)
TSURUGAI KENGO (JP)
Application Number:
PCT/JP2012/056773
Publication Date:
September 20, 2012
Filing Date:
March 15, 2012
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
TAKAMURA NORITOSHI (JP)
MASUDA MICHIYA (JP)
SASUGA ICHIRO (JP)
KATO NOBUHARU (JP)
TSURUGAI KENGO (JP)
TAKAMURA NORITOSHI (JP)
MASUDA MICHIYA (JP)
SASUGA ICHIRO (JP)
KATO NOBUHARU (JP)
TSURUGAI KENGO (JP)
International Classes:
F16F1/12; H01L23/40; F16F1/36; H01L23/473
Foreign References:
| JP2005228877A | 2005-08-25 | |||
| JP2007166820A | 2007-06-28 | |||
| JP2001304336A | 2001-10-31 | |||
| JPH10107194A | 1998-04-24 | |||
| JP2001167745A | 2001-06-22 |
Other References:
See also references of EP 2688096A4
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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Claims:
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