PRETREATMENT METHOD AND PRETREATMENT DEVICE

WIPO Patent Application WO/2014/034171

A1

The present invention provides a plating pretreatment technique whereby, when a workpiece is plated with the surface to be plated facing downward, the effects of air bubbles, etc., on the fine vias or trenches formed in the surface to be plated are minimized and the plating can be carried out reliably. The present invention is a method for pretreatment for plating in which a plating solution is supplied to a workpiece that is held so that the surface to be plated faces downward, and the plating solution is brought into contact with the surface to be plated, thereby conducting the plating, the method comprising: placing the workpiece in the upper part of a pretreatment tank; heating the workpiece; reducing the pressure inside the pretreatment tank to 9-40 hPa and supplying 10-30ºC water to the pretreatment tank, thereby replacing the gas inside the pretreatment tank with vaporized water; filling the pretreatment tank with water to bring the water into contact with the surface to be plated; and thereafter introducing the air into the pretreatment tank to make the pretreatment tank have atmospheric pressure and to render water adherent to the surface to be plated.

ODAGIRI YASUSHI (JP)

PCT/JP2013/061241

March 06, 2014

April 16, 2013

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ELECTROPLATING ENG (JP)

C25D5/34; C25D7/12

JPS6449298A	1989-02-23
JP2005226119A	2005-08-25
JPH11181574A	1999-07-06
JPH04250874A	1992-09-07

TANAKA AND OKAZAKI (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)

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