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Patent Searching and Data


Title:
PRIMER COMPOSITION, PRIMER COATING FILM AND FORMATION METHOD THEREFOR, AND FORMATION METHOD FOR COATING FILM
Document Type and Number:
WIPO Patent Application WO/2019/123822
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a primer composition which can quickly form a primer coating film which has excellent adhesion to a metal base material, adhesion to a top coating film containing a polyamide resin, and corrosion resistance. This primer composition that solves the problem is characterized by comprising a phenolic resin (A), a polyamide resin (B), and a solvent (C), wherein the phenolic resin (A) is a resole phenolic resin, the polyamide resin (B) is soluble in the solvent (C), and the solid content mass ratio (A/B) of the phenolic resin (A) to the polyamide resin (B) is 80/20 to 99/1.

Inventors:
HOKKA Jyunsuke (4-1-15, Minamishinagaw, Shinagawa-ku Tokyo 75, 〒1408675, JP)
Application Number:
JP2018/039503
Publication Date:
June 27, 2019
Filing Date:
October 24, 2018
Export Citation:
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Assignee:
NIPPON PAINT INDUSTRIAL COATINGS CO., LTD. (4-1-15, Minamishinagawa Shinagawa-ku Tokyo, 75, 〒1408675, JP)
International Classes:
C09D161/06; C09D5/00; C09D7/61; C09D7/65; C09D177/00
Domestic Patent References:
WO2012165439A12012-12-06
Foreign References:
JPH03281618A1991-12-12
JPS6162568A1986-03-31
JP2013071327A2013-04-22
CN103666183A2014-03-26
JP2009126010A2009-06-11
Attorney, Agent or Firm:
SUGIMURA Kenji (36F Kasumigaseki Common Gate West, 3-2-1 Kasumigasek, Chiyoda-ku Tokyo 13, 〒1000013, JP)
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