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Patent Searching and Data


Title:
PRIMER COMPOSITION FOR ELECTROLYTIC PLATING, MANUFACTURING METHOD FOR PLATED ARTICLE, AND PLATED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2013/129030
Kind Code:
A1
Abstract:
The present invention is a primer composition for electrolytic plating that is used when performing electrolytic plating. The purpose of the present invention is to provide a primer composition for electrolytic plating that is capable of forming an electrolytic plate layer that exhibits excellent adhesive properties with a substrate on the surface of the substrate. The primer composition for electrolytic plating is characterized by comprising (a) metallic microparticles and (b) at least one component selected from the group consisting of an acrylic monomer, an acrylic oligomer, an acrylic resin, an epoxy resin, a urethane resin, and an ester resin.

Inventors:
FUJITA TAKAFUMI (JP)
HOSOMI TETSUYA (JP)
Application Number:
JP2013/052447
Publication Date:
September 06, 2013
Filing Date:
February 04, 2013
Export Citation:
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Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C25D5/54; C03C17/10; C09D4/02; C09D5/00; C09D7/12; C09D163/00; C25D5/56; C25D7/00
Foreign References:
JP2008130921A2008-06-05
JP2009138217A2009-06-25
JPH01301882A1989-12-06
JPH09194768A1997-07-29
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
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Claims: