PRIMER COMPOSITION AND METHOD OF BONDING THEREWITH

Title:

PRIMER COMPOSITION AND METHOD OF BONDING THEREWITH

Document Type and Number:

WIPO Patent Application WO/2002/100967

Kind Code:

A1

Abstract:

The invention provides a primer composition excellent in adhesion to porous substrates and a method of bonding, particularly, a primer composition characterized by containing (A) a vinyl copolymer obtained by copolymerizing a monomer component essentially comprising (a) 5 to 80 wt% of a monomer having a silicon−containing group which bears a hydroxyl or hydrolyzable group bonded to the silicon atom and causes crosslinking via the formation of a siloxane linkage and (b) 20 to 95 wt% of an alkyl (meth)acrylate monomer wherein the alkyl has 1 to 8 carbon atoms and (B) a vinyl copolymer obtained by copolymerizing a monomer component essentially comprising (a) 5 to 80 wt% of a monomer having a silicon−containing group which bears a hydroxyl or hydrolyzable group bonded to the silicon atom and causes crosslinking via the formation of a siloxane linkage and (c) 20 to 95 wt% of an alkyl (meth)acrylate monomer wherein the alkyl has 10 or more carbon atoms&semi and a method of bonding a sealant to a substrate, characterized by applying the primer composition onto a substrate and then making a sealant adhere to the resulting coated surface of the substrate.

Inventors:

OKAMOTO TOSHIHIKO (JP)
HAGIWARA KAZUO (JP)
TAKASE JUNJI (JP)

Application Number:

PCT/JP2002/004967

Publication Date:

December 19, 2002

Filing Date:

May 22, 2002

Export Citation:

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Assignee:

KANEKA CORP (JP)
OKAMOTO TOSHIHIKO (JP)
HAGIWARA KAZUO (JP)
TAKASE JUNJI (JP)

International Classes:

C08F220/12; C08F230/08; C09D5/00; C09D133/06; C09D143/04; C09D183/04; C09J5/00; C09K3/10; C08L43/04; (IPC1-7): C09J5/02; C09J143/04; C09J183/00; C09K3/10

Foreign References:

JPH11209682A	1999-08-03
JPH11209683A	1999-08-03
JPH11209684A	1999-08-03

Other References: