Title:
PRINTED BOARD
Document Type and Number:
WIPO Patent Application WO/2017/006552
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a printed board that can suppress EMI emissions from power-source wiring. In order to achieve said purpose, this printed board is characterized in that the printed board is provided with a plurality of ground layers, which sandwich a power-source layer, in that at least the outer circumference of the printed board is provided with through holes that connect the plurality of ground layers, and in that the through holes are provided at intervals that correspond to the wavelength associated with the maximum frequency of electromagnetic waves that are to be suppressed. This printed circuit board is also characterized in that a power-source layer that is provided to the printed board is sandwiched from above and below by ground layers, in that a plurality of through holes connect the upper and lower ground layers, and in that the through holes are provided at the power-source layer and in the vicinity thereof at intervals that correspond to the wavelength associated with the maximum frequency of electromagnetic waves that are to be suppressed.
Inventors:
KASHIWAKURA KAZUHIRO (JP)
UEMURA AYAKO (JP)
UEMURA AYAKO (JP)
Application Number:
PCT/JP2016/003168
Publication Date:
January 12, 2017
Filing Date:
July 04, 2016
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H05K1/02; H05K3/46; H05K9/00
Domestic Patent References:
| WO2011111314A1 | 2011-09-15 |
Foreign References:
| JP2001068801A | 2001-03-16 | |||
| JP2009224566A | 2009-10-01 | |||
| JP2007088102A | 2007-04-05 |
Attorney, Agent or Firm:
SHIMOSAKA, Naoki (JP)
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