Title:
PRINTED CIRCUIT BOARD, ANTENNA, WIRELESS COMMUNICATION DEVICE AND MANUFACTURING METHODS THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/152538
Kind Code:
A1
Abstract:
Disclosed are a low-loss printed circuit board, a low-loss broadband antenna, and methods for manufacturing the printed circuit board and the antenna using a resin as a substrate material. A resin material (101) having a predetermined shape is manufactured in a forming step, and the resin material (101) is foamed in a foaming step, thereby forming a skin layer (111) and a foam section (112). Since the skin layer (111) does not permit plating to be deposited thereon, the skin layer (111) is removed in a conductor pattern shape in a skin layer removing step, and the foam section (112) inside is exposed. Plating is deposited on the foam section (112), which has anchor effects, by performing electroless plating in a conductor layer forming step, and a conductor layer (120) is formed.
Inventors:
HAMADA HIROKI (JP)
TAMAOKA HIROYUKI (JP)
ISO YOICHI (JP)
TAMAOKA HIROYUKI (JP)
ISO YOICHI (JP)
Application Number:
PCT/JP2011/062850
Publication Date:
December 08, 2011
Filing Date:
June 03, 2011
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
HAMADA HIROKI (JP)
TAMAOKA HIROYUKI (JP)
ISO YOICHI (JP)
HAMADA HIROKI (JP)
TAMAOKA HIROYUKI (JP)
ISO YOICHI (JP)
International Classes:
H05K3/18; H01P11/00; H01Q1/24; H01Q1/38; H01Q9/42; H01Q13/08; H04B1/18; H05K3/00; H05K3/14
Foreign References:
| JP2922856B2 | 1999-07-26 | |||
| JP2006135090A | 2006-05-25 | |||
| JP2007208859A | 2007-08-16 | |||
| JP2007089109A | 2007-04-05 | |||
| JP2007267003A | 2007-10-11 | |||
| JP2000101341A | 2000-04-07 | |||
| US7492321B2 | 2009-02-17 | |||
| JP2007306507A | 2007-11-22 | |||
| JPH1075115A | 1998-03-17 |
Other References:
See also references of EP 2579695A4
Attorney, Agent or Firm:
MATSUSHITA, MAKOTO (JP)
Matsushita δΊ® (JP)
Matsushita δΊ® (JP)
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Claims: