PRINTED CIRCUIT BOARD ASSEMBLY

WIPO Patent Application WO/2019/087352

A1

This printed circuit board assembly includes: a first printed circuit board having a slit section formed therein, and comprising a first surface and a second surface that is a surface on the side facing away from the first surface; and a second printed circuit board comprising a third surface, a fourth surface that is a surface on the side facing away from the third surface, a first edge section, and a second edge section that is an edge section on the side facing away from the first edge section, the first edge section being inserted into the slit section, and the forward edge of the first edge section protruding from the second surface. On the second surface, the first printed circuit board has a plurality of first electrodes provided along the length direction of the slit section. On the third surface and the fourth surface of the first edge section, the second printed circuit board has a plurality of second electrodes joined to the plurality of the first electrodes through soldering. In addition, the first printed circuit board has a fixed body that has been fixed onto the first surface, and the second printed circuit board is adhered onto the fixed body by an adhesive substance.

NAKASE SHUSAKU (JP)
MORIMOTO YUSUKE (JP)

PCT/JP2017/039728

May 09, 2019

November 02, 2017

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MITSUBISHI ELECTRIC CORP (JP)

H05K1/14

WO2017002720A1

2017-01-05

JP2008171849A	2008-07-24
JPS5771372U	1982-04-30
JP2015115533A	2015-06-22
JP2004153178A	2004-05-27
JPS58187168U	1983-12-12

KISA PATENT & TRADEMARK FIRM (JP)

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