Title:
PRINTED CIRCUIT BOARD ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/060040
Kind Code:
A1
Abstract:
A printed circuit board assembly may comprise: a main printed circuit board including a first main signal line and a first dielectric having a first permittivity; a subsidiary printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and a first connection block for connecting the first main signal line of the main printed circuit board to the first sub signal line of the subsidiary printed circuit board.
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Inventors:
HWANG BO HOON (KR)
Application Number:
PCT/KR2019/010536
Publication Date:
March 26, 2020
Filing Date:
August 20, 2019
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/14; H05K1/02; H05K3/34
Foreign References:
| JP2001015880A | 2001-01-19 | |||
| KR20170003366U | 2017-09-27 | |||
| US20010042636A1 | 2001-11-22 | |||
| US8866563B1 | 2014-10-21 | |||
| JPH04212440A | 1992-08-04 |
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
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