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Title:
PRINTED CIRCUIT BOARD COVERED WITH PROTECTIVE FILM AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/198404
Kind Code:
A1
Abstract:
According to the present invention, a release film (24) and a protective film (22) are provided over a printed circuit board (7). A connection terminal (14) and an electronic component (15) are respectively provided in a first area (8a) and a second area (8b) of the printed circuit board (7). The release film (24) is selectively provided between the first area (8a) and an adhesive layer (23) of the protective film (22). The first area (8a) and the second area (8b) are laminated with the protective film (22). The protective film (22) is selectively removed from the first area (8a). Therefore, it is possible to manufacture a printed circuit board (1) covered with a protective film having high reliability.

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Inventors:
TANABE TSUYOSHI (JP)
ASAYAMA SHINJI (JP)
AJIOKA SHOICHI (JP)
SASAKI SHUNSUKE (JP)
Application Number:
PCT/JP2019/009909
Publication Date:
October 17, 2019
Filing Date:
March 12, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K3/28
Foreign References:
JP2008186937A2008-08-14
JP2013165207A2013-08-22
JPH09324153A1997-12-16
JP2008155467A2008-07-10
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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