Title:
PRINTED CIRCUIT BOARD DIVIDING TOOL, AND METHOD FOR DIVIDING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/155726
Kind Code:
A1
Abstract:
The present invention divides a printed circuit board from a sheet, which is composed of a plurality of printed circuit boards connected by a connection part, by cutting the connection part without generating distortions such as would damage the components of the sheet. A printed circuit board dividing tool (10) is provided with a first member (1), a second member (2), and a gripping part (24). The first member (1) has a first edge part (5). The second member (2) has a second edge part (6) disposed so as to face the first edge part (5). The first member (1) and the second member (2) are configured to be capable of alternately entering a first state in which the first edge part (5) and the second edge part (6) are touching and a second state in which the first edge part (5) and the second edge part (6) are separated. The gripping part (24) switches between the first state and the second state. The first member (1) has a first protruding part (7a) disposed on one end side of the first edge (5).
Inventors:
IZUTA GORO (JP)
Application Number:
PCT/JP2018/043150
Publication Date:
August 15, 2019
Filing Date:
November 22, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B26B17/00; H05K3/00
Foreign References:
| JPH07236777A | 1995-09-12 | |||
| JPH01188292A | 1989-07-27 | |||
| JPS3630360Y1 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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