Title:
PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND PRINTED CIRCUIT BOARD PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/045975
Kind Code:
A1
Abstract:
An electronic device, a printed circuit board, and a printed circuit board preparation method. The printed circuit board comprises a layer structure body, a transmission line (1), which is used for transmitting a signal, and at least two plated-through holes (2), which penetrate through the layer structure body, wherein the transmission line (1) is located in the layer structure body, and the two ends of the transmission line (1) are directly connected to hole walls of the two plated-through holes (2), respectively.
Inventors:
XIE JIAN (CN)
WEI ZHONGMIN (CN)
REN XIAOYING (CN)
WEI ZHONGMIN (CN)
REN XIAOYING (CN)
Application Number:
PCT/CN2023/110088
Publication Date:
March 07, 2024
Filing Date:
July 31, 2023
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K1/02; H05K3/00
Foreign References:
| CN112584600A | 2021-03-30 | |||
| CN214154943U | 2021-09-07 | |||
| CN108323002A | 2018-07-24 | |||
| CN105578714A | 2016-05-11 | |||
| CN101711097A | 2010-05-19 | |||
| CN2886982Y | 2007-04-04 | |||
| FR2909833A1 | 2008-06-13 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPER TY ATTORNEYS (CN)
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