Title:
PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/045977
Kind Code:
A1
Abstract:
A printed circuit board, comprising a layered structure body (1) and transmission lines (2) for transmitting signals. The transmission lines (2) are located in the layered structure body (1). The layered structure body (1) comprises a first region and a second region, the first region is a region for performing inter-layer signal transmission in the layered structure body (1), and the second region is a region other than the first region; the first thickness (d1) of each transmission line (2) in the first region is less than the second thickness (d2) of the transmission line (2) in the second region, and the first thickness (d1) is less than or equal to a first preset threshold. Also provided are an electronic device and a printed circuit board manufacturing method.
Inventors:
XIE JIAN (CN)
WEI ZHONGMIN (CN)
YIN CHANGGANG (CN)
WEI ZHONGMIN (CN)
YIN CHANGGANG (CN)
Application Number:
PCT/CN2023/110102
Publication Date:
March 07, 2024
Filing Date:
July 31, 2023
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K1/02
Foreign References:
| CN104717848A | 2015-06-17 | |||
| CN104717850A | 2015-06-17 | |||
| CN114641133A | 2022-06-17 | |||
| CN111148378A | 2020-05-12 | |||
| CN108419376A | 2018-08-17 | |||
| CN104684264A | 2015-06-03 | |||
| CN114126260A | 2022-03-01 | |||
| KR20190131739A | 2019-11-27 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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