Title:
PRINTED CIRCUIT BOARD EMBEDDED PROTECTION COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2018/218658
Kind Code:
A1
Abstract:
Provided herein are approaches for embedding one or more protection components within a substrate, such as a printed circuit board (PCB). In one approach, an apparatus includes a first PCB layer and a second PCB layer, and a plurality of protection components formed between the first and second PCB layers. The apparatus further includes a core housing encasing the plurality of protection components, and a set of encapsulation layers formed over first and second sides of the core housing. In some approaches, the plurality of protection components are selected from the group consisting of: fuses, positive temperature coefficient devices, integrated circuits, and/or sensors. Electronic components, such as resistors and capacitors may be surface mounted on the top side of PCB to complete the protection circuit with the protection components. Through terminal connection, reflow soldering or other approaches, the apparatus may be connected to a battery pack to protect battery operation.
Inventors:
HU CHENG (CN)
TIAN YU (CN)
WANG BING (CN)
BU JIANMING (CN)
TIAN YU (CN)
WANG BING (CN)
BU JIANMING (CN)
Application Number:
PCT/CN2017/086983
Publication Date:
December 06, 2018
Filing Date:
June 02, 2017
Export Citation:
Assignee:
LITTELFUSE ELECTRONICS SHANGHAI CO LTD (CN)
International Classes:
H01M10/04
Foreign References:
| US20130280558A1 | 2013-10-24 | |||
| CN102544615A | 2012-07-04 | |||
| US8492888B2 | 2013-07-23 |
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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