Title:
PRINTED CIRCUIT BOARD HAVING INCREASED DURABILITY IN BENT AREA AND ELECTRONIC DEVICE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2023/068583
Kind Code:
A1
Abstract:
According to an embodiment, a printed circuit board includes an extension area extending along one direction and a bent area bent with respect to the extension area, wherein the extension area and the bent area include: a nonconductive layer; a first conductive layer disposed on one surface of the nonconductive layer; a second conductive layer disposed on the other surface of the nonconductive layer; and a via hole extending through the nonconductive layer, the first conductive layer, and the second conductive layer, and in the bent area, the cross-sectional area of the via hole in contact with the first conductive layer may be smaller than the cross-sectional area of the via hole in contact with the second conductive layer. Various other embodiments may be possible.
Inventors:
LEE YOUNGSUN (KR)
PARK SUNGWON (KR)
HONG EUNSEOK (KR)
PARK SUNGWON (KR)
HONG EUNSEOK (KR)
Application Number:
PCT/KR2022/014444
Publication Date:
April 27, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; H05K1/11; H05K3/28
Domestic Patent References:
| WO2020122180A1 | 2020-06-18 |
Foreign References:
| US8913398B2 | 2014-12-16 | |||
| US20060076160A1 | 2006-04-13 | |||
| US8119924B2 | 2012-02-21 | |||
| KR20200007377A | 2020-01-22 |
Attorney, Agent or Firm:
KWANG AND JANG INTELLECTUAL PROPERTY LAW FIRM (KR)
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