Title:
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/062037
Kind Code:
A1
Abstract:
Provided is a manufacturing method of a printed circuit board, wherein voids do not remain within a through hole filled with electroplating. A through hole conductor (42) is comprised of a first electroplating film (38) provided with a protrusion section (38a) protruding in the axis direction, and a second electroplating film (40) that is filled within a recess section formed by the first electroplating film. The cross section of the interface between the first electroplating film (38) and the second electroplating film (40) is U-shaped, with an opening at the opening-side of the through hole (34). That is, since the first electroplating film (38) is formed to be a U shape and no acute angled section exists, voids can easily come out of the through hole and will not remain within the through hole.
Inventors:
KAWAI SATORU (JP)
KIMISHIMA YASUKI (JP)
KIMISHIMA YASUKI (JP)
Application Number:
PCT/JP2010/069070
Publication Date:
May 26, 2011
Filing Date:
October 27, 2010
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
International Classes:
H05K1/11; H05K3/40
Foreign References:
| JP2008214679A | 2008-09-18 | |||
| JP2005072235A | 2005-03-17 | |||
| JP2005310934A | 2005-11-04 | |||
| JP2003110241A | 2003-04-11 | |||
| JP2005159043A | 2005-06-16 | |||
| JP2006339350A | 2006-12-14 |
Attorney, Agent or Firm:
TASHITA Akihito (JP)
Akito Tashimo (JP)
Akito Tashimo (JP)
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