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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/117604
Kind Code:
A3
Abstract:
The present invention relates to a printed circuit board and a method for manufacturing the same, which can ensure productivity and economic efficiency. Specifically, the present invention relates to: a method for manufacturing a printed circuit board by using a separating core member in which a metal release layer separable from a first metal layer is interposed between the first metal layer and a second metal layer; and a printed circuit board manufactured thereby.

Inventors:
KANG KYU HONG (KR)
LEE JEONG KYU (KR)
HONG SEUNG MIN (KR)
LEE SANG HWAN (KR)
Application Number:
KR2017/015029
Publication Date:
August 16, 2018
Filing Date:
December 19, 2017
Export Citation:
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Assignee:
DOOSAN CORP (KR)
International Classes:
H05K3/46; H05K3/20; H05K3/38; H05K3/42
Foreign References:
JP2010199616A2010-09-09
KR20050076612A2005-07-26
KR20080079997A2008-09-02
KR20120048409A2012-05-15
KR20120008619A2012-02-01
Attorney, Agent or Firm:
YOON, Yu Kwang et al. (6th Fl Chinyang Bldg., 47, Kyonggidae-ro,,Seodaemun-gu, Seoul, KR)
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