Title:
PRINTED CIRCUIT BOARD PRODUCTION METHOD AND EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2006/051889
Kind Code:
A1
Abstract:
In order to produce a printed circuit board while stabilizing the line width of a pattern, a laminator (2) laminates a resist layer on a substrate (K) and exposes information indicative of the date of lamination to the substrate (K). An exposure device (3) reads out the information on the date of lamination before exposure and judges whether the time elapsed after lamination falls within a predetermined hold time or not. If the judgment is negated, an operator is warned by the exposure device (3) that the time elapsed after lamination deviates from the predetermined hold time. Since a desired line width cannot be attained for that substrate (K), the operator can remove that substrate (K) from the exposure device (3).
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Inventors:
SASAKI YOSHIHARU (JP)
Application Number:
PCT/JP2005/020675
Publication Date:
May 18, 2006
Filing Date:
November 04, 2005
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD (JP)
SASAKI YOSHIHARU (JP)
SASAKI YOSHIHARU (JP)
International Classes:
H05K3/00; G03F7/20; H05K3/06
Foreign References:
| JP2003280177A | 2003-10-02 | |||
| JP2004048044A | 2004-02-12 | |||
| JPH0331487A | 1991-02-12 |
Attorney, Agent or Firm:
Yanagida, Masashi (7F Shin-Yokohama KS Bldg., 3-18-3,
Shin-Yokohama, Kohoku-k, Yokohama-shi Kanagawa, JP)
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