Title:
PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/077804
Kind Code:
A1
Abstract:
In one mode of the present invention, the printed circuit board comprises an insulating base film, an electroconductive pattern layered on parts of the top surface side of the base film, a covering layer layered on the top surface of a layered body containing the base film and the electroconductive pattern, and having openings that partially expose the electroconductive pattern, and a tin-plating layer layered on the top surface of the electroconductive pattern so as to be exposed through the openings. With the inner edge of the opening section serving as the reference end, the mean detachment length of the covering layer from the electroconductive pattern is 20 μm or shorter.
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Inventors:
OHSUKA RYUTA (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
OKAUE JUNICHI (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
OKAUE JUNICHI (JP)
Application Number:
PCT/JP2018/023922
Publication Date:
April 25, 2019
Filing Date:
June 25, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/24; H05K1/09; H05K3/18
Domestic Patent References:
| WO2003069967A1 | 2003-08-21 |
Foreign References:
| JP2001168147A | 2001-06-22 | |||
| JPH0971870A | 1997-03-18 | |||
| JP2004103706A | 2004-04-02 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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