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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD SUBSTRATE BURR REMOVING APPARATUS FOR ELECTRONIC DEVICE PRODUCTION
Document Type and Number:
WIPO Patent Application WO/2023/024043
Kind Code:
A1
Abstract:
A PCB substrate burr removing apparatus for electronic device production. The apparatus comprises a collecting box (1), wherein two fixing supports (2) are fixedly mounted at the top of the collecting box (1); lifting grooves are provided in the tops of both the fixing supports (2); lifting rods (3) are slidably mounted in both the lifting grooves; the same top plate (4) is fixedly mounted at the top ends of the two lifting rods (3); an air cylinder (12) is fixedly mounted on one side of each of the two fixing supports (2), and output shafts of the two air cylinders (12) are both fixedly connected to the bottom of the top plate (4); a rotation hole is provided in the top of the top plate (4); a rotating base (5) is rotatably mounted in the rotation hole; two fixing slots are provided in the bottom of the rotating base (5); and polishing rollers (6) are slidably mounted in the two fixing slots.

Inventors:
LING YAN (CN)
CAI CHANGYONG (CN)
MO LEI (CN)
ZHU JING (CN)
WANG LEITAO (CN)
LU HAIYAN (CN)
Application Number:
PCT/CN2021/114857
Publication Date:
March 02, 2023
Filing Date:
August 26, 2021
Export Citation:
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Assignee:
CHENGDU AERONAUTIC POLYTECHNIC (CN)
International Classes:
B24B5/48; B24B5/06; B24B5/35; B24B5/40
Foreign References:
CN213258519U2021-05-25
CN213288778U2021-05-28
CN213608289U2021-07-06
CN107471050A2017-12-15
CN214024855U2021-08-24
DE4211592A11993-10-14
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