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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/130691
Kind Code:
A1
Abstract:
Provided is a printed circuit board substrate provided with a base film having insulating properties and a sintered body layer of metal particles laminated upon one surface of the base film. The arithmetic mean roughness (Sa) of the surface of the sintered body layer on the opposite side from the base film is 0.005 μm to 0.10 μm.

Inventors:
SUGIURA MOTOHIKO (JP)
OKADA ISSEI (JP)
OHKI KENJI (JP)
Application Number:
PCT/JP2018/035237
Publication Date:
July 04, 2019
Filing Date:
September 24, 2018
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/38; B32B15/08; H05K1/03; H05K1/09
Domestic Patent References:
WO2017090625A12017-06-01
WO2017057301A12017-04-06
Foreign References:
JP2013164990A2013-08-22
JP2016152405A2016-08-22
JP2014110514A2014-06-12
JP2012142318A2012-07-26
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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